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        6000 FSA光刻機

        應用于半導體行業:

        半導體加工設備-光刻設備-UV光刻機

        產品品牌

        OAI

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        品牌:OAI

        型號:

        所屬系列:半導體加工設備-光刻設備-UV光刻機

        型號6000 FSA用于生產的全自動,上側或后側光刻機

         

        用于:半導體,MEMS,傳感器,微流體,IOT,包裝

        憑借在半導體行業40多年的制造,OAI滿足了一個新的精英階段的生產光刻設備的動態市場的日益增長的挑戰。

        建立在著名的OAI模塊化平臺上,6000系列具有完全自動化的亞微米分辨率的頂側或背側對齊,提供無與倫比的性價比。

        對準器具有先進的光束光學,在第一掩模模式下具有優于±3%的均勻性和每小時180個晶片的吞吐量,這導致更高的產量。 6000系列可以處理厚和粘合基板(高達7000微米),翹曲晶片(高達7 mm-10mm),薄基板(低至100微米厚)和厚光致抗蝕劑的各種晶片。

        具有卓越的工藝重復性,6000系列是所有生產環境的完美解決方案。選擇頂部或可選的背面對齊,使用OAI的基于Cognex的自定義模式識別軟件。對于總體光刻工藝,Series1 6000可以與集束工具無縫集成。 OAI的新生產面罩對齊器是總包。

        好處

        ·全自動

        ·側面對齊

        •可選:底部對齊

        UV到NUV

        ·集群工具集成

        ·自定義軟件

        規格

         

        曝光系統

        曝光模式真空接觸硬接觸軟接觸接近(2μ間隙)

        高級光束

        均勻梁尺寸:50mm - 200mm方形/圓

        200mm-300mm見方/圓

        均勻度:優于±3%

        相機:雙攝像頭與CCTV擴展的景深

        對齊系統

        模式識別CognexvisionPro¹™與OAI定制軟件

        對準精度0.5μ頂面

        1.0μ,頂部到底部可選背面對齊

        預對準精度優于±50μ

        自動對齊頂部到底部

        頂部

        晶片處理

        基材尺寸50mm-200mm圓形或方形或200mm-300mm圓形或正方形

        薄晶片低至100M

        翹曲晶片高達7mm-10mm

        厚和粘合基板高達7000μ

        機器人單臂和雙臂晶片處理

        失步補償標準軟件或可選的熱卡盤

        晶片尺寸轉換5分鐘以內

        吞吐量第一掩模每小時180個晶片 - 隨后75-100個晶片每小時

        楔形效果平整3點或可選非接觸

        可用選項

        IR自動對齊,

        盒式磁帶映射

        365nm LED曝光光源

        溫度控制晶片卡盤

        集成屏蔽管理控制

        用于全光刻的集成光刻集群

        使用SMIF或FOUP接口模塊的過程環境控制

        非接觸式調平

        邊緣夾緊

         Model 6000 FSA Fully Automated, Topside or Backside Mask Aligner for Production

        光刻機Model6000FSA Mask Aligner

        For: Semiconductors, MEMS, Sensors, Microfluidics, IOT, Packaging

        With over 4 decades of manufacturing in the semiconductor industry, OAI meets the growing challenge of a dynamic market with a new elite class of production photolithography equipment.

        Built on the venerable OAI modular platform, the Series 6000 has topside or backside alignment that is fully automated with sub-micron resolution which delivers performance that is unmatched at any price.

        The Aligners have Advanced Beam Optics with better than ±3% uniformity and a throughput of 180 wafers per hour in first mask mode, which results in higher yields. The Series 6000 can handle a wide variety of wafers from thick and bonded substrates (up to 7000 microns), warped wafers (up to 7 mm-10mm), thin substrates (down to 100 micron thick), and thick photo resist.

        With superb process repeatability, the Series 6000 is the perfect solution for all production enviroments. Choose either top side or optional back side alignment which uses OAI's customized pattern recognition software that is Cognex based. For the total lithography process, the Seriesl 6000 can be integrated seamlessly with cluster tools. OAI's new production mask Aligners are the total package.

        BENEFITS

        · Fully Automated

        · Topside Alignment

        · Optional: Bottomside Alignment

        · DUV to NUV

        · Cluster Tool Integration

        · Customized Software

        SPECIFICATIONS

         

         

        Exposure System

        Exposure Modes

        Vacuum contact

        Hard contact

        Soft contact

        Proximity (2μ gap)

         

        Advanced Beam Optics

        Uniform Beam Size:

        50mm - 200mm square/round

         

        200mm - 300 mm square/round

        Uniformity:

        Better than ±3%

        Camera:

        Dual Camera with CCTV with Expanded Depth of Field

        Alignment System

        Pattern Recognition

        Cognex visionPro¹™ with OAI customized software

        Alignment Accuracy

        0.5μ topside

         

        1.0μ with top to bottom optional backside alignment

        Pre-alignment Accuracy

        Better than ±50μ

        Auto-alignment

        Top to bottomside

         

        Topside

        Wafer Handling

        Substrate size

        50mm – 200mm round or square or 200mm-300mm round or square

         

        Thin wafers

        Down to 100Μ

         

        Warped Wafers

        Up to 7mm-10mm

         

        Thick & Bonded Substrates

        Up to 7000μ

         

        Robotics

        Single and dual arm wafer handling

         

        Run-out compensation

        Standard software or optional thermal chuck

         

        Wafer size conversion

        5 minutes or less

         

        Throughput

        1st mask 180 wafers per hour - subsequent 75-100 wafers per hour

         

        Wedge Effect Leveling

        3 point or optional non-contact

         

        Available Options

         

        IR Auto-align,

         

         

        Cassette Mapping

         

         

        365nm LED Exposure Light Source

         

         

        Temperature Controlled Wafer Chuck

         

         

        Integrated Mask Management Control

         

         

        Integrated Lithography Cluster for Full Lithography

         

         

        Process Environment Control with SMIF or FOUP Interface Modules

         

         

        Non-contact Leveling

         

         

        Edge Gripping

         

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